Taiwan Semiconductor Manufacturing Company, Limited (traditional Chinese: 台灣積體電路製造股份有限公司; pinyin: tái wān jī tǐ dìan lù zhì zǎo gǔ fēn yǒu xìan gōng sī, abbrev. TSMC[2]) NYSE: TSM is the world's largest dedicated independent semiconductor foundry, with its headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. TSMC's market capitalization as of 1 January 2009 is US$40.4 billion.
Although TSMC offers a variety of wafer product-lines (high-voltage, mixed-signal, analog), TSMC is best known for its logic chip product line.
Various fabless high-tech companies such as Applied Micro Circuits Corporation, Qualcomm, Altera, Broadcom, Conexant, Marvell, NVIDIA, and VIA are customers of TSMC. Some fab-owning companies like Intel also outsource some production to TSMC[3].
Facilities
- One 150 mm (6 inches) wafer fab in full operation (Fab 2)
- Five 200 mm (8 inches) wafer fabs in full operation (Fabs 3, 5, 6, 7, 8)
- Two 300 mm (12 inches) wafer fabs in production (Fabs 12, 14)
- TSMC (Shanghai)
- WaferTech, TSMC's wholly owned subsidiary 200 mm fab in Camas, Washington, USA
- SSMC (Systems on Silicon Manufacturing Co.), a joint venture with NXP Semiconductors in Singapore which has also brought increased capacity since the end of 2002
According to
Taipei Times TSMC is also planning to build another fab.
TSMC is proactively taking step to satisfy the semiconductor industry's needs. No longer is a logic focused process technology able to meet all market requirements. Rather, today's industry innovator requires special feature technologies such as mixed-signal/RF, embedded high density memory, non-volatile memory, high voltage devices and CMOS image sensor technologies. Feature technologies span TSMC's Advanced and Mainstream Logic Technology platforms. All feature technologies are supported down to the 0.18-micron process node. Embedded high density memory is available in Advanced Technology platforms down to the0.13-micorn node. Mixed signal technology is available down to the 90nm process node. Together, TSMC's feature technologies, integrated with their corresponding logic technologies provide a total platform solution meeting the industry's broadest range of IC design requirements.
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| HDM |
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TSMC provides a wide array of technology and process options when it comes to high density memory (HDM). Customers can easily identify the best-fit technology and process node based on their design and desired cost model. Full logic compatibility allows customers to enjoy benefit of using existing IP at design stage, shorter manufacturing cycle time, excellent yields, minimal cost premium and fast time-to-market.... |
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| NVM |
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| TSMC's embedded non-volatile memory offering (NVM) sees the foundry segment's most comprehensive and innovative technologies. Depending on application complexity, customers can choose from high-density capable EmbFlashSM to low-density logic NVM and Electrical Fuse. TSMC's NVM process line has been widely used to manufacture a broad range of products found in MCU, DSP, smart card, cellular communications, automotive, CPLD, and many other applications.... |
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| MS / RF |
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| Looking for the foundry leader in Mixed Signal/RF technology production? Look to TSMC. We are the only foundry shipping over one and half million Mixed-Signal/RF wafers.... |
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| SiGe |
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| TSMC is the first pure-play foundry to offer silicon germanium (SiGe) BiCMOS technology, which is expected to be in high demand for high performance and low power communications applications... |
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| High Voltage |
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| TSMC provides the foundry’s broadest portfolio of high voltage process technologies and services to meet the growing demand for the hottest new digital multimedia products. TSMC’s high voltage processes, coupled with our manufacturing expertise and value-added services, have brought leading edge products to market within some of the tightest market windows for over 10 years.... |
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| 40nm |
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| TSMC takes platform performance to the next level of density and power with the introduction of its 40nm process technology... |
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| 55nm |
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| TSMC's 55nm process is a 90% linear shrink process from the 65nm process... |
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| 65nm |
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| The 65nm process offers cost-effective benefits superior to the 90nm node... |
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| 90nm |
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| Since 2004, TSMC has succeeded to ramp the NexsysSM 90nm process in TSMC's state-of-the-art 12-inch fab, Fab12... |
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| 0.13µm |
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| TSMC 0.13-micron process technology delivers the optimal combination of gate density, speed and power. ... |
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| Mixed Signal/RF |
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| TSMC's fully logic-compatible mixed signal/RF technology features... |
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| DFM |
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| Design For Manufacturing (DFM) is the latest in a series of efforts by TSMC to empower customer innovations... |
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| Mask Service |
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| TSMC's in-house mask shop is one of the largest in the world... |
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